This course, offered by CU Boulder, provides a comprehensive analysis of metal-semiconductor and pn junction contacts. It covers topics such as equilibrium behavior, current and capacitance responses under bias and breakdown, non-rectifying behavior, and surface effects. The course aims to equip learners with the skills to apply sophisticated analysis to electronic devices. Key learning outcomes include the ability to analyze the pn junction at equilibrium, under bias, capacitance, current characteristics, and breakdown behavior. Learners will also gain the skills to analyze the contact between metal and semiconductor at equilibrium, under bias, capacitance, current characteristics, non-rectifying contacts, and surface effects. This course is part of CU Boulder's Master of Science degree in Electrical Engineering and can be taken for academic credit as ECEA5631. It is ideal for individuals interested in pursuing a career in diode engineering or those who want to deepen their understanding of metal semiconductor junctions and semiconductor contact.
